An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.
INTELLIGENT POWER MODULE, ELECTRIC VEHICLE OR HYBRID VEHICLE, AND METHOD OF ASSEMBLING INTELLIGENT POWER MODULE
2024-08-01
Patent
Elektronische Ressource
Englisch
IPC: | B60W CONJOINT CONTROL OF VEHICLE SUB-UNITS OF DIFFERENT TYPE OR DIFFERENT FUNCTION , Gemeinsame Steuerung oder Regelung von Fahrzeug-Unteraggregaten verschiedenen Typs oder verschiedener Funktion / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen |
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