An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.
INTELLIGENT POWER MODULE, ELECTRIC VEHICLE OR HYBRID VEHICLE, AND METHOD OF ASSEMBLING INTELLIGENT POWER MODULE
30.11.2017
Patent
Elektronische Ressource
Englisch
IPC: | B60W CONJOINT CONTROL OF VEHICLE SUB-UNITS OF DIFFERENT TYPE OR DIFFERENT FUNCTION , Gemeinsame Steuerung oder Regelung von Fahrzeug-Unteraggregaten verschiedenen Typs oder verschiedener Funktion / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen |
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