An electronics assembly includes a base and a plurality of modules. The base is configured for mechanical attachment to a tire. The base includes an electronic device, and also includes a mechanical attachment element. Each module includes an electronic device, a lower mechanical attachment element, and an upper mechanical attachment element. The lower mechanical attachment element on each one of the modules is configured for attachment to the upper mechanical attachment element on any other one of the modules. In this configuration, the modules are interchangeably mechanically attachable to each other in a stacked arrangement. Each lower mechanical attachment element is also configured for attachment to the mechanical attachment element on the base. The modules are thus mechanically attachable to the base interchangeably with each other, which enables any one of the modules to be installed as the lowermost module in the stacked arrangement.


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    Titel :

    TIRE ELECTRONICS ASSEMBLY


    Beteiligte:
    SCHEIFELE KEVIN E (Autor:in) / DORFI HANS R (Autor:in)

    Erscheinungsdatum :

    2022-09-22


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B60C VEHICLE TYRES , Fahrzeugreifen



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