An electronics assembly is provided for use with a tire. The assembly includes a plurality of printed circuit boards, each of which includes an electronic device configured to sense a condition of the tire. Attachment pegs are provided to attach the printed circuit boards together in stacked positions that are spaced apart by the attachment pegs. Each attachment peg has a lower end portion configured to attach to any one of the printed circuit boards. Each attachment peg further has an upper end portion configured to attach to any other one of the printed circuit boards. This enables the printed circuit boards to be attached interchangeably between the stacked positions.


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    Titel :

    TIRE ELECTRONICS ASSEMBLY


    Beteiligte:
    SCHEIFELE KEVIN E (Autor:in) / DORFI HANS R (Autor:in)

    Erscheinungsdatum :

    12.12.2024


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B60C VEHICLE TYRES , Fahrzeugreifen / B29D PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE , Herstellen besonderer Gegenstände aus Kunststoff oder aus Stoffen in plastischem Zustand



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