Provided is a semiconductor device including: a laminated substrate in which a circuit layer, an insulating layer, and a metal layer are sequentially laminated. A slit is formed in the circuit layer. A recess recessed from one surface side facing the insulating layer toward the other surface side is formed in the metal layer. The recess of the metal layer has a relaxation portion at least partially overlapping the slit of the circuit layer in a planar view.


    Zugriff

    Download


    Exportieren, teilen und zitieren



    Titel :

    Semiconductor device, semiconductor module, vehicle, and manufacturing method of semiconductor device


    Beteiligte:
    TAKANO SHO (Autor:in)

    Erscheinungsdatum :

    01.10.2024


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen



    SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

    KAWASE TATSUYA / MIYAMOTO NOBORU / ISHIHARA MIKIO et al. | Europäisches Patentamt | 2016

    Freier Zugriff

    Semiconductor module, semiconductor device, and vehicle

    KAWASE TATSUYA / MIYAMOTO NOBORU / ISHIHARA MIKIO et al. | Europäisches Patentamt | 2022

    Freier Zugriff