A panel assembly for use with a spacecraft includes a payload, a radiator panel and a heat pipe. The payload is configured to generate waste heat during operation. The radiator panel is spaced apart from the payload and is configured to dissipate waste heat. The heat pipe is coupled to the payload and the radiator panel. The heat pipe includes a compliant portion to permit the radiator panel to move relative to the payload. Further the heat pipe is configured to transfer waste heat from the payload to the radiator panel.


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    Titel :

    Heat transfer assemblies with compliant heat pipes


    Beteiligte:
    MCKINNON DOUGLAS V (Autor:in) / AMBROSE JAY H (Autor:in) / CONNOR SPENCER K (Autor:in) / MURRAY BRONSON (Autor:in)

    Erscheinungsdatum :

    2023-11-28


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    F28D Wärmetauscher, soweit in keiner anderen Unterklasse vorgesehen, in denen die Wärmetauschmittel nicht in direkte Berührung miteinander kommen , HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT / B64G Raumfahrt , COSMONAUTICS



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