Aspects of wireless communication are described, including a radiofrequency (RF) amplifier chip, configured for transmitting or receiving data, comprising a first substrate comprising a first material and a second substrate comprising a second material that is different from the first material. The first substrate and the second substrate may be lattice-matched such that an interface region between the first substrate and the second substrate exhibits an sp3 carbon peak at about 1332 cm·1 having a full width half maximum of no more than 5.0 cm·1 as measured by Raman spectroscopy. In some aspects, the first substrate and said second substrate permit said chip to transmit or receive data at a transfer rate of at least 500 megabits per second and a frequency of at least 8 GHz. In some aspects, the RF amplifier chip is part of a satellite transmitter.
Wireless communication system with improved thermal performance
2022-11-08
Patent
Elektronische Ressource
Englisch
IPC: | H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B64G Raumfahrt , COSMONAUTICS / G01J Messen der Intensität, der Geschwindigkeit, der spektralen Zusammensetzung, der Polarisation, der Phase oder der Pulscharakteristik von infrarotem, sichtbarem oder ultraviolettem Licht , MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT / H04B TRANSMISSION , Übertragung / H04W WIRELESS COMMUNICATION NETWORKS , Drahtlose Kommunikationsnetze |
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