A high efficiency satellite transmitter comprises an RF amplifier chip in thermal contact with a radiant cooling element via a heat conducting element. The RF amplifier chip comprises an active layer disposed on a high thermal conductivity substrate having a thermal conductivity greater than about 1000 W/mK, maximizing heat conduction out of the RF amplifier chip and ultimately into outer space when the chip is operating within a satellite under normal transmission conditions. In one embodiment, the active layer comprises materials selected from the group consisting of GaN, InGaN, AlGaN, and InGaAlN alloys. In one embodiment, the high thermal conductivity substrate comprises synthetic diamond.


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    Titel :

    Wireless transmitter with improved thermal management


    Beteiligte:
    EJECKAM FELIX (Autor:in) / MITCHELL JR TYRONE D (Autor:in) / SAUNIER PAUL (Autor:in)

    Erscheinungsdatum :

    2023-02-28


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B64G Raumfahrt , COSMONAUTICS / H04B TRANSMISSION , Übertragung



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