A manufacturing method of a physical quantity sensor includes forming first and second fixed electrodes, and a dummy electrode on a substrate; and a movable body forming. The electrode forming includes forming a first mask layer on the substrate, forming a first electrode material layer by forming a first conductive layer on the substrate and the first mask layer, forming a second conductive layer on the substrate and the first electrode material layer, forming a second mask layer by forming a mask material layer on the second conductive layer, and removing a part of a section of the mask material layer not overlapping the first electrode material layer in plan view, and forming a second electrode material layer by etching the second conductive layer, with the second mask layer as a mask such that the second conductive layer is provided on the first electrode material layer and on the substrate.
Physical quantity sensor manufacturing method, physical quantity sensor, electronic device, and vehicle
2020-12-01
Patent
Elektronische Ressource
Englisch
IPC: | H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / B81B Mikrostrukturbauelemente oder -systeme, z.B. mikromechanische Bauelemente , MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES / B81C Verfahren oder Geräte besonders ausgebildet zur Herstellung oder Behandlung von Mikrostrukturbauelementen oder -systemen , PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS / G01P MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION OR SHOCK , Messen der Linear- oder Winkelgeschwindigkeit, der Beschleunigung, der Verzögerung oder des Stoßes |
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