The present invention provides a MEMS and a sensor having the MEMS which can be formed without a process of etching a sacrifice layer. The MEMS and the sensor having the MEMS are formed by forming an interspace using a spacer layer. In the MEMS in which an interspace is formed using a spacer layer, a process for forming a sacrifice layer and an etching process of the sacrifice layer are not required. As a result, there is no restriction on the etching time, and thus the yield can be improved.


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    Titel :

    Micro electro mechanical system, semiconductor device, and manufacturing method thereof


    Beteiligte:
    YAMAGUCHI MAYUMI (Autor:in) / IZUMI KONAMI (Autor:in) / TATEISHI FUMINORI (Autor:in)

    Erscheinungsdatum :

    31.07.2018


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H10N / B60C VEHICLE TYRES , Fahrzeugreifen / B81C Verfahren oder Geräte besonders ausgebildet zur Herstellung oder Behandlung von Mikrostrukturbauelementen oder -systemen , PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS



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