To suppress warpage of a cooling unit.SOLUTION: A cooling device for a semiconductor module including a semiconductor chip comprises: a top plate; a case part that includes a coolant circulation part, an outer edge part surrounding the coolant circulation part, and a bottom plate arranged so as to be opposed to the top plate, and in which the bottom plate has an upper surface opposed to the top plate and a lower surface opposite to the upper surface, and the coolant circulation part is arranged between a lower surface of the top plate and the upper surface of the bottom plate and arranged so as to be tightly adhered directly or indirectly to the lower surface of the top plate at the outer edge part; a cooling fin arranged in the coolant circulation part; and a reinforcement plate fixed to the lower surface of the bottom plate.SELECTED DRAWING: Figure 1A

    【課題】冷却器の反りを抑制する。【解決手段】半導体チップを含む半導体モジュール用の冷却装置であって、天板と、冷媒流通部、冷媒流通部を囲む外縁部、および天板と対向して配置された底板を含み、底板は天板と対向する上面と、上面とは逆側の下面とを有し、冷媒流通部は天板の下面と底板の上面との間に配置され、且つ、外縁部において天板の下面に直接または間接に密着して配置されたケース部と、冷媒流通部に配置された冷却フィンと、底板の下面に固定された補強板とを備える冷却装置。【選択図】図1A


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    Titel :

    COOLING DEVICE, SEMICONDUCTOR MODULE AND VEHICLE


    Weitere Titelangaben:

    冷却装置、半導体モジュールおよび車両


    Beteiligte:
    ARAI NOBUHIDE (Autor:in)

    Erscheinungsdatum :

    2019-10-24


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Japanisch


    Klassifikation :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / H05K PRINTED CIRCUITS , Gedruckte Schaltungen



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