A circuit card assembly comprising at least one electronic component that generates heat and a thermal management system the at least one electronic component is disclosed. The thermal management system comprises one or more phase change modules for distributing and storing heat; a metal frame in thermal contact with the at least one electronic component and having at least one opening for receiving the one or more phase change modules; and a heat transfer apparatus in thermal contact with one or more of the at least one electronic component and the metal frame. The heat transfer apparatus comprises at least one heat pipe and/or at least one heat spreader. The heat transfer apparatus provides a first heat transfer path during a period of reduced heat dissipation or cooling. The one or more phase change modules distributes and stores heat during the period of reduced heat dissipation or cooling.


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    Titel :

    Circuit card assemblies


    Beteiligte:
    JOO-HAN KIM (Autor:in) / BRIAN HODEN (Autor:in) / LUCIUS AKALANNE (Autor:in)

    Erscheinungsdatum :

    07.05.2025


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B64G Raumfahrt , COSMONAUTICS / F42B EXPLOSIVE CHARGES, e.g. FOR BLASTING , Explosive Ladungen, z.B. für Sprengungen / G06F ELECTRIC DIGITAL DATA PROCESSING , Elektrische digitale Datenverarbeitung / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES



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