A method of manufacturing a sealed circuit card assembly includes disposing a circuit card assembly within a volume defined by a housing and at least partially filling the volume with a curable liquid such that the curable liquid encapsulates at least a circuit card. The method may also include curing the curable liquid to form a potted circuit card assembly and, after at least partially filling the volume with the curable liquid and after curing the curable liquid, vacuum impregnating the potted circuit card assembly with a sealant to seal any exposed interfaces or cracks to form the sealed circuit card assembly. Accordingly, the sealed circuit card assembly may include a first cured material encapsulating the circuit card of the circuit card assembly and a second cured material disposed within, for example, a porosity of the first cured material.


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    Titel :

    Sealed circuit card assembly


    Beteiligte:

    Erscheinungsdatum :

    11.08.2020


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    B29C Formen oder Verbinden von Kunststoffen , SHAPING OR JOINING OF PLASTICS / B29L INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES , Index-Schema für besondere Gegenstände in Verbindung mit Unterklasse B29C / B60T Bremsanlagen für Fahrzeuge oder Teile davon , VEHICLE BRAKE CONTROL SYSTEMS OR PARTS THEREOF / H02K Dynamoelektrische Maschinen , DYNAMO-ELECTRIC MACHINES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen



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