An electronic component housing that internally houses an electronic component includes a portion formed of a resin material and a portion formed of a metallic material. The portion formed of the resin material is a connection side portion opposed to a member as a connection partner of the electronic component housing, or an opposite portion opposed to the connection side portion. The electronic component housing further includes an electromagnetic shield member that covers an outer surface of the portion formed of the resin material.


    Zugriff

    Download


    Exportieren, teilen und zitieren



    Titel :

    HOUSING FOR ELECTRONIC COMPONENT


    Weitere Titelangaben:

    GEHÄUSE FÜR ELEKTRONISCHE KOMPONENTE
    BOÎTIER DE COMPOSANT ÉLECTRONIQUE


    Beteiligte:
    ONO KIMIHIRO (Autor:in)

    Erscheinungsdatum :

    15.02.2023


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



    ELECTRONIC COMPONENT HOUSING CASE AND ELECTRONIC COMPONENT HOUSING BODY

    AKIYAMA YUJI / OHARA HOMARE | Europäisches Patentamt | 2019

    Freier Zugriff

    HOUSING FOR ELECTRONIC COMPONENT

    ONO KIMIHIRO | Europäisches Patentamt | 2019

    Freier Zugriff

    HOUSING AND ELECTRONIC COMPONENT

    NAKADA TSUYOMASA / YASUDA TAKESHI | Europäisches Patentamt | 2015

    Freier Zugriff

    HOUSING OF ELECTRONIC COMPONENT MODULE

    YOSHIDA SHINYA / NAKANISHI RAITA | Europäisches Patentamt | 2018

    Freier Zugriff

    Waterproof structure for electronic component housing unit

    IKEDA TOMOHIRO / KOIZUMI KOJI | Europäisches Patentamt | 2015

    Freier Zugriff