An electronic component housing that internally houses an electronic component includes a portion formed of a resin material and a portion formed of a metallic material. The portion formed of the resin material is a connection side portion opposed to a member as a connection partner of the electronic component housing, or an opposite portion opposed to the connection side portion. The electronic component housing further includes an electromagnetic shield member that covers an outer surface of the portion formed of the resin material.
HOUSING FOR ELECTRONIC COMPONENT
GEHÄUSE FÜR ELEKTRONISCHE KOMPONENTE
BOÎTIER DE COMPOSANT ÉLECTRONIQUE
15.02.2023
Patent
Elektronische Ressource
Englisch
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