A heater panel includes a core (102) and a heater/dielectric layer (104) including a positive thermal coefficient (PTC) heater layer between a pair of dielectric layers. A structural facing (110) is included, wherein the heater/dielectric layer (104) is bonded directly between the core and the structural facing. A second structural facing (112) can be bonded to the core (102) opposite the heater/dielectric layer (104). An impact layer (114) can be bonded to the structural facing (110), e.g., the first structural facing (110) described above, opposite the heater/dielectric layer (104).


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    Titel :

    HEATED FLOOR PANELS


    Weitere Titelangaben:

    BEHEIZTE BODENPLATTEN
    PANNEAUX DE PLANCHER CHAUFFÉS


    Beteiligte:
    CHING NATHANIEL (Autor:in) / HU JIN (Autor:in) / SLANE CASEY (Autor:in)

    Erscheinungsdatum :

    08.01.2020


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H05B ELECTRIC HEATING , Elektrische Heizung / B64C AEROPLANES , Flugzeuge



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