A heater panel (100) includes a core (102) and a heater/dielectric layer (104) including a positive thermal coefficient (PTC) heater layer (106) between a pair of dielectric layers (108). A structural facing (110) is included, wherein the heater/dielectric layer (104) is bonded directly between the core (102) and the structural facing (110). A second structural facing (112) can be bonded to the core (102) opposite the heater/dielectric layer (104). An impact layer (114) can be bonded to the structural facing (110), e.g., the first structural facing described above, opposite the heater/dielectric layer (104). The heater layer (110) can be formed by direct writing a heating element pattern onto a dielectric layer (108) bonded to the core (102).
HEATED FLOOR PANELS
BEHEIZTE BODENPLATTEN
PANNEAUX DE PLANCHER CHAUFFANTS
2020-01-08
Patent
Elektronische Ressource
Englisch