A heater panel (100) includes a core (102) and a heater/dielectric layer (104) including a positive thermal coefficient (PTC) heater layer (106) between a pair of dielectric layers (108). A structural facing (110) is included, wherein the heater/dielectric layer (104) is bonded directly between the core (102) and the structural facing (110). A second structural facing (112) can be bonded to the core (102) opposite the heater/dielectric layer (104). An impact layer (114) can be bonded to the structural facing (110), e.g., the first structural facing described above, opposite the heater/dielectric layer (104). The heater layer (110) can be formed by direct writing a heating element pattern onto a dielectric layer (108) bonded to the core (102).


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    Titel :

    HEATED FLOOR PANELS


    Weitere Titelangaben:

    BEHEIZTE BODENPLATTEN
    PANNEAUX DE PLANCHER CHAUFFANTS


    Beteiligte:
    HU JIN (Autor:in) / CHING NATHANIEL (Autor:in) / SLANE CASEY (Autor:in) / BOTURA GALDEMIR CEZAR (Autor:in)

    Erscheinungsdatum :

    2020-01-08


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H05B ELECTRIC HEATING , Elektrische Heizung / B64C AEROPLANES , Flugzeuge



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