The advanced technology necessary for building future space exploration vehicles includes microfabricated coils for making possible self‐inductances integrated with other passive and active electronic components. Integrated inductances make possible significant improvements in reliability over the traditional arrangement of using external discrete inductances, as well as allowing significant size (volume) reductions (also important in space vehicles). Two possible fabrication techniques (one using proprietary branded “Foturan” glass, the other using silicon wafer substrates) for microscopic coils are proposed, using electroplating into channels. The techniques have been evaluated for fabricating the planar electrical coils needed for typical microelectromechanical systems applications. There remain problems associated with processing using “Foturan” glass, but coil fabrication on silicon wafers was successful. Fabrication methods such as these are expected to play an important part in the development of systems and subsystems for forthcoming space exploration missions.
Techniques For Microfabricating Coils For Microelectromechanical Systems Applications
SPACE TECHNOLOGY AND APPLICATIONS INTERNATIONAL FORUM‐STAIF 2008: 12th Conference on Thermophysics Applications in Microgravity; 1st Symposium on Space Resource Utilization; 25th Symposium on Space Nuclear Power and Propulsion; 6th Conference on Human/Robotic Technology and the Vision for Space Exploration; 6th Symposium on Space Colonization; 5th Symposium on New Frontiers and Future Concept ; 2008 ; Albuquerque (New Mexico)
AIP Conference Proceedings ; 969 , 1 ; 969-976
21.01.2008
8 pages
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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