Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

1–20 of 86 hits
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    Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests

    Corazza, Michael / Krebs, Frederik C. / Gevorgyan, Suren A. | Tema Archive | 2014
    Keywords: Verkapseln

    Gehäusekonzepte für Leistungs-MOSFETs und Schottky-Dioden

    Keller, Kevin | Tema Archive | 2011
    Keywords: verbesserte Einkapselung

    Heat transfer and thermal management of electric vehicle batteries with phase change materials

    Ramandi, M.Y. / Dincer, I. / Naterer, G.F. | Tema Archive | 2011
    Keywords: Kapselung

    Stability of spore-based biosensing systems under extreme conditions

    Sangal, Abhishek / Pasini, Patrizia / Daunert, Sylvia | Tema Archive | 2011
    Keywords: Kapselung

    New method to determine the range of DVB-H networks and the influence of MPE-FEC rate and modulation scheme

    Plets, David / Joseph, Wout / Verloock, Leen et al. | Tema Archive | 2009
    Keywords: MPE (multiprotocol encapsulation)

    Metal-enclosed, air-insulated traction switchgear - developments and applications

    Lönard, Detlef / Northe, Jens | Tema Archive | 2006
    Keywords: Kapselung

    Thermal management of Li-ion battery with phase change material for electric scooters: experimental validation

    Khateeb, S.A. / Amiruddin, S. / Farid, M. et al. | Tema Archive | 2005
    Keywords: Wärmehaushalt (Kapselung)

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archive | 2005
    Keywords: Verkapseln

    The changing automotive environment: high-temperature electronics

    Johnson, R.W. / Evans, J.L. / Jacobsen, P. et al. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    Kapselung des Kraftaggregates der Automobile des Automobilwerkes Minsk

    Gauchstejn, I.S. / Korsakov, V.V. / Kunovskij, E.B. et al. | Tema Archive | 2003
    Keywords: Kapselung

    Prediction of thermal performance of wire-bonded plastic ball grid array package for underhood automotive applications

    Ramakrishna, K. / Trent, J.R. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories

    Harboe-Sorensen, R. / Guerre, F.X. / Loquet, J.G. et al. | Tema Archive | 2003
    Keywords: Chip-Größen-Kapselung

    Akustik- und Schwingungskomfort des neuen BMW 5er

    Thoma, G. / Bersiner, F. | Tema Archive | 2003
    Keywords: Kapselung

    Neue Werkstoffe und Entwicklungs-Tools für den Hitzeschutz

    Cierocki, K. / Bridge, D. | Tema Archive | 2001
    Keywords: Kapselung

    Titanium armor applications in combat vehicles

    Montgomery, J.S. / Wells, M.G.H. | Tema Archive | 2001
    Keywords: Verkapseln

    Optimized cooling systems for high-power semiconductor devices

    Baumann, H. / Heinemeyer, P. / Staiger, W. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Plastic encapsulated components for cars

    Hanreich, G. / Nicolics, J. / Musiejovsky, L. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archive | 2001
    Keywords: Chip-on-board-Kapselung

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archive | 2000
    Keywords: Flip-Chip-Verkapselung