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On the isolation of science payloads from spacecraft vibrations
Novel composites for space microelectronics and optics
Novel component packaging for high current applications using power semiconductor devices
Non-hermetic embedded MCM technologies for automotive and other lower cost applications
New techniques and thermoplastics for encapsulating automotive sensors and solenoids
New method for electrothermal simulations: HDTMOS in automotive applications
NASA Lewis advanced individual pressure vessel (IPV) nickel/hydrogen technology
Multilayer alumina substrates for ECU (automotive electronics)
Möglichkeiten zur Schallreduzierung bei Deckeln und Hauben
Model for BGA and CSP reliability in automotive underhood applications
Millimeterwellen-Mikrosysteme für Kraftfahrzeug und Verkehrsleittechnik
Microwave multichip modules using low cost microwave chip on flex packaging technology
MEMS package in a harsh environment for aeronautic applications
Memory chip packaging-an enabling technology for high-performance recce systems
Maximizing lumen output of LEDs for automotive exterior signal lighting applications