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KAPSELUNG
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Novel composites for space microelectronics and optics
Accelerated testing of flip chip packages under dynamic load
Untersuchungen zur Reduzierung des vom Motor erzeugten Fahrzeuginnen- und -außengeräusches
Assessment of high-heat-flux thermal management schemes
Thermal management for high performance computing in spaceborne applications
Variable emissivity through MEMS technology
Acceleration threshold switches from an additive electroplating MEMS process
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
Memory chip packaging-an enabling technology for high-performance recce systems
MECON - eine neuartige Hochspannungs-Steckverbindung für Unterwasser-Anwendungen