Synonyms were used for: KAPSELUNG
Search without synonyms: keywords:(KAPSELUNG)

81–100 of 265 hits
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    Plastic encapsulated components for cars

    Hanreich, G. / Nicolics, J. / Musiejovsky, L. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Novel composites for space microelectronics and optics

    Kowbel, W. / Champion, W. / Oliver, P. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Chip-Größen-Kapselung

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archive | 2001
    Keywords: Chip-on-board-Kapselung

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archive | 2001
    Keywords: Flip-Chip-Verkapselung

    Submarine Horizontal Launch TACTOM Capsule

    J. C. Callahan | NTIS | 2001
    Keywords: Encapsulation

    Assessment of high-heat-flux thermal management schemes

    Mudawar, I. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Reliability of commercial plastic encapsulated microelectronics at temperatures from 125 degrees C to 300 degrees C

    McCluskey, P. / Mensah, K. / O'Connor, C. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Thermal management for high performance computing in spaceborne applications

    Samson, J.R. jun. / Cutting, F.M. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Variable emissivity through MEMS technology

    Garrison Darrin, A. / Osiander, R. / Champion, J. et al. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    Acceleration threshold switches from an additive electroplating MEMS process

    Michaelis, S. / Timme, H.J. / Wycisk, M. et al. | Tema Archive | 2000
    Keywords: Chip-Größen-Kapselung

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archive | 2000
    Keywords: Flip-Chip-Verkapselung

    Akustikbauteile im Motorraum

    Hysky, J. / Brück, E. | Tema Archive | 1999
    Keywords: Kapselung

    Encapsulated aluminium pigments

    Kiehl, A. / Greiwe, K. | Tema Archive | 1999
    Keywords: Verkapseln

    Memory chip packaging-an enabling technology for high-performance recce systems

    Kaufman, B. | Tema Archive | 1999
    Keywords: Chip-on-board-Kapselung

    MECON - eine neuartige Hochspannungs-Steckverbindung für Unterwasser-Anwendungen

    Ostergaard, I. / Sande, G. / Nysveen, A. et al. | Tema Archive | 1999
    Keywords: Kapselung