Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

61–80 of 256 hits
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    Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories

    Harboe-Sorensen, R. / Guerre, F.X. / Loquet, J.G. et al. | Tema Archive | 2003
    Keywords: Chip-Größen-Kapselung

    High temperature, high power density packaging for automotive applications

    Gerber, M. / Ferreira, J.A. / Hofsajer, I.W. et al. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation

    Creusen, M. | Tema Archive | 2003
    Keywords: Einkapselung

    Akustik- und Schwingungskomfort des neuen BMW 5er

    Thoma, G. / Bersiner, F. | Tema Archive | 2003
    Keywords: Kapselung

    Model for BGA and CSP reliability in automotive underhood applications

    Lall, P. / Islam, N. / Suhling, J. | Tema Archive | 2003
    Keywords: Chip-Größen-Kapselung

    Thermal management of military fighter aircraft electro-optics pod: an invited paper

    Price, D.C. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    New development of a wet brake system

    Nowak, S. | Tema Archive | 2002
    Keywords: Verkapseln

    Thermal modeling of secondary lithium batteries for electric vehicle/hybrid electric vehicle applications

    Al-Hallaj, S. / Selman, J.R. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)

    Neue Werkstoffe und Entwicklungs-Tools für den Hitzeschutz

    Cierocki, K. / Bridge, D. | Tema Archive | 2001
    Keywords: Kapselung

    Titanium armor applications in combat vehicles

    Montgomery, J.S. / Wells, M.G.H. | Tema Archive | 2001
    Keywords: Verkapseln

    Optimized cooling systems for high-power semiconductor devices

    Baumann, H. / Heinemeyer, P. / Staiger, W. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Plastic encapsulated components for cars

    Hanreich, G. / Nicolics, J. / Musiejovsky, L. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Novel composites for space microelectronics and optics

    Kowbel, W. / Champion, W. / Oliver, P. et al. | Tema Archive | 2001
    Keywords: Wärmehaushalt (Kapselung)

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Chip-Größen-Kapselung

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archive | 2001
    Keywords: Chip-on-board-Kapselung

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archive | 2001
    Keywords: Flip-Chip-Verkapselung

    Submarine Horizontal Launch TACTOM Capsule

    J. C. Callahan | NTIS | 2001
    Keywords: Encapsulation

    Assessment of high-heat-flux thermal management schemes

    Mudawar, I. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)