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packaging
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photonics
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Effect of process-induced stress in InP/InGaAsP weakly confined waveguides [3952-20]
Steered agile beams support for Army requirements [3952-34]
Novel photonic ATM switching architecture based on free-space optical interconnect [3952-30]
Polymeric optoelectronic interconnects (Invited Paper) [3952-23]
Novel guided-wave thermo-optic beam deflector [3952-04]
Vertical-cavity modulator for optical interconnection and its high-speed performance [3952-27]
Optical backplane in planar technology [3952-06]
Interference pattern analysis of optical CDMA system using the SCAE and SCAD [3952-03]
Advances in silica-based photonic integrated circuits (Invited Paper) [3952-50]
Implementation of high-speed optical transmitters [3952-40]
MT-compatible polymeric waveguide couplers for optoelectronic packaging [3952-26]
High-speed Si MSM photodetector and VCSEL for optoelectronic interconnects [3952-41]
Design of scalable optical interconnection network using wavelength division multiplexing [3952-21]
Image fiber skew characteristics [3952-07]
Error- and flow-control protocols for terabit optical networks (Invited Paper) [3952-01]
Packaging technology of OptoBGA for 2.4 Gb/s [3952-44]