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Kraftfahrzeugelektronik
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3D integration of image sensor SiP using TSV silicon interposer
Accelerated testing of flip chip packages under dynamic load
Alternative solders for flip chip applications in the automotive environment
High temperature potential of flip chip assemblies for automotive applications
Integration of micro-mechatronics in automotive applications
Micro-mechatronics in automotive applications
Micro-opto-electro-mechanical-systems (MOEMS) in automotive applications
Modellierung und Anwendung von Silizium-Mikrofonsystemen