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Thermomechanical properties
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Development of a 700 W anode-supported micro-tubular SOFC stack for APU applications
Die Bedeutung der Applikation für die Zuverlässigkeit von bleifreien Steuergeräten
Mechanical analysis of PEM fuel cell stack design
Mechanical analysis of PEM fuel cell stack design
Reliability potential of epoxy based encapsulants for automotive applications
Heißgeprägte MID-Baugruppen für erhöhte thermische Anforderungen. HT-Thermoplaste
Long term reliability testing of HV-IGBT modules in worst case traction operation
High temperature potential of flip chip assemblies for automotive applications
Effect of post-mold curing of epoxy molding compound on wirebond reliability in a MOSFET