1–20 of 179 hits
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    Component to Multi-Track Feeder Assignment and Boaxd Sequencing in Printed Circuit Boaxd Assembly

    Li, Y.A. | Online Contents | 2002
    Publisher: World Scientific , Singapore

    The Impacts of Variability on Scheduling Approaches for a Printed Wiring Boaxd Assembly Operation

    Pfund, M. | Online Contents | 2002
    Publisher: World Scientific , Singapore

    Neural Network Open Loop Control System for Wave Soldering

    Coit, D.W. | Online Contents | 2002
    Publisher: World Scientific , Singapore

    Optimization of PCB Component Placement Using Genetic Algorithms

    Jeevan, K. | Online Contents | 2002
    Publisher: World Scientific , Singapore

    Economic Sensitivity for End of Life Planning and Processing of Personal Computers

    Boon, J.E. | Online Contents | 2002
    Publisher: World Scientific , Singapore

    Modeling of Material Handling Hoist Operations in a PCB Manufacturing Facility

    Mak, R.W.T. | Online Contents | 2002
    Publisher: World Scientific , Singapore

    Scheduling of Printed Wiring Board Assembly in Surface Mount Technology Lines

    Sawik, T. | Online Contents | 2002
    Publisher: World Scientific , Singapore

    Direct Immersion Cooled Microelectronics Heat Sinks: Effects of Test Fluid and Bonding Technique

    Bhavnani, S.H. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Analytical Forced Convection Modeling of Plate Fin Heat Sinks

    Teeristra, P. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Evaluation of Plasma Treated HASL Finish PCBs Using DCA Measurements

    Takyi, G. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Turbulent Flow and Heat Transfer Over Heated Modules for a Wide Range of Reynolds Numbers and Module Size

    Deb, P. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Models to Estimate Printed Circuit Board Fabrication Yield During the Design Stage

    Giachetti, R. E. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Paxametric Studies of Microchannel Conjugate Liquid Flows with Zeta Potential Effects

    Ng, E.Y.K. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Analysis and Experiments of Ball Deformation for Ultra-Fine-Pitch Wire Bonding

    Zhong, Z. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Screen Printing Process Design of Experiments for Fine Line Printing of Thick Film Ceramic Substrates

    Pan, J. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Properties of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems

    Lu, D. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Printed Circuit Board Manufacturing and Testing of RIMM[TM]

    Lau, J. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Design Considerations of High Heat Flux Heat Pipe Evaporators

    Zuo, Z.J. | Online Contents | 2000
    Publisher: World Scientific , Singapore

    Computer Take-back and Recycling: An Economic Analysis for Used Consumer Equipment

    Jung, L. B. | Online Contents | 1999
    Publisher: World Scientific , Singapore

    The "Green Design Advisor": A Tool for Design for Environment

    Feldmann, K. | Online Contents | 1999
    Publisher: World Scientific , Singapore