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    SYSTEMS AND METHODS FOR JOINING NODES AND OTHER STRUCTURES

    Free access
    OKOLI CHUKWUBUIKEM MARCEL / TENHOUTEN DAVID BRIAN / MARTINEZ ANTONIO BERNERD et al. | European Patent Office | 2022

    Assembling structures comprising 3D printed components and standardized components utilizing adhesive circuits

    Free access
    CZINGER KEVIN ROBERT / MARTINEZ ANTONIO BERNERD / TENHOUTEN BROC WILLIAM et al. | European Patent Office | 2022

      ASSEMBLING STRUCTURES COMPRISING 3D PRINTED COMPONENTS AND STANDARDIZED COMPONENTS UTILIZING ADHESIVE CIRCUITS

      Free access
      CZINGER KEVIN ROBERT / MARTINEZ ANTONIO BERNERD / TENHOUTEN BROC WILLIAM et al. | European Patent Office | 2019

      ASSEMBLING STRUCTURES COMPRISING 3D PRINTED COMPONENTS AND STANDARDIZED COMPONENTS UTILIZING ADHESIVE CIRCUITS

      Free access
      CZINGER KEVIN ROBERT / MARTINEZ ANTONIO BERNERD / TENHOUTEN BROC WILLIAM et al. | European Patent Office | 2023