Debonding between asphalt layers is usually modeled as a global or “smeared” phenomenon across the entire lane. However, field evidence indicates debonding may be limited to a portion of the interface. The objective of this study was to determine the potential location and extent of localized interface debonding in asphalt pavements so that more realistic interface conditions and pavement responses can be employed in future performance predictions. A parametric study was conducted to locate stress states potentially conducive to interface debonding. Factors considered included asphalt concrete (AC) layer thickness, AC-to-base stiffness ratio, interface compliance, tire size, and traffic wander. The parametric study showed existence of a zone of high shear stress coupled with low confinement for a broad range of depths (1–3 in. below the surface) and extending to 2 in. from the tire edge. Given the drop in confinement immediately outside the tire edge and that shear stress magnitude in this zone was similar to shear strength values reported in the literature, it was concluded that the repetition of these critical stress state conditions can cause localized debonding of an interface located about 2 in. below the pavement surface. Existence of a potential zone of localized interface debonding around the edge of a tire can promote a debonded strip below the wheelpath, which is consistent with field observations. The width of the debonded strip can extend to 42 in. Future research efforts should examine the stress redistribution associated with the presence of a debonded strip below the wheelpath.


    Access

    Download

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Identification of Potential Location and Extent of Localized Interface Debonding in the Wheelpath of Asphalt Pavements


    Additional title:

    Transportation Research Record


    Contributors:


    Publication date :

    2018-04-04




    Type of media :

    Article (Journal)


    Type of material :

    Electronic Resource


    Language :

    English