This paper presents an approach combining electrical and thermal analyses to predict the thermal performance of electrical centers and junction blocks. On the component level, procedures are outlined for developing electrical and thermal models of electro-mechanical and circuit protection devices contained in Bussed Electrical Centers (BECs). Then a method for creating a system level steady state model of a BEC is dicussed. Several BEC designs have been modeled using a largely automated process, and the predicted temperatures agree well with test results.


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    Title :

    Thermal-electrical modeling of electrical subsystems


    Additional title:

    Thermisch-elektrische Modellierung eines elektrischen Subsystems


    Contributors:

    Published in:

    Publication date :

    1998


    Size :

    6 Seiten, 15 Bilder


    Remarks:

    (Beilage Delphi Automotive Systems)



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English




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