When utilizing induction heating for curing adhesives to obtain quick handling strength, heating the complete bond line is the accepted and proven process. Challenging this process is the induction spot curing (partial cure of the bond line) process. This paper will analyze the strength of the induction spot curing process, and compare it to the strength attained when we induction cure the entire bond line. Both one and two component adhesives, as well as metal and plastic substrates, will be examined. Examples and application advantages of both processes will also be presented.
Strength analysis of the induction spot and full bonding processes
Festigkeitsanalyse von induktiv erwärmten ausgehärteten Teilen einer Klebeverbindung
SAE-Papers ; Mar ; 1-5
1990
5 Seiten, 4 Bilder
Conference paper
English
Strength Analysis of the Induction Spot and Full Bonding Processes
SAE Technical Papers | 1990
|Strength analysis of the induction spot and full bonding process
Automotive engineering | 1990
|Spot-weld bonding on the Blackhawk helicopter
NTRS | 1972
|Anti-Static Spot Blaster Provides Ideal Bonding Surface
Emerald Group Publishing | 1989
Strength to strength . BWIA aims for Caribbean top spot
Online Contents | 1999