New materials and powder technology have been applied to conductor formulations targeted for the harsh environments of under the hood automotive applications. The rapid growth and performance enhancement needs of the automotive industry have necessitated the development of new materials that take advantage of the high temperature performance and reliability of ceramic circuit technology. This paper describes the testing and performance of a new system of Ag/Pd conductors that are necessary to further improve performance of ceramic circuits. New metal powder and glass technology has been successfully applied to conductor compositions targeted at the automotive market. The new system offers advancements in large aluminum wire bonding performance and environmental stability. It meets the evolving needs of harsh automotive applications and broadens the potential use of ceramic circuitry. An assessment of current automotive requirements is discussed. The results reported are on a 3/1 Ag/Pd, including some test data on low Pd content materials. Benchmark testing was done, including materials currently being used in the automotive industry. The improvements achieved with the new powder technology are noted. Two methods of interconnection technology were evaluated: heavy gauge aluminum wire bonding and soldered lead attach. Environmental testing used to prove the reliability of this material included aged adhesion, high humidity and temperature, thermal cycling, and autoclave testing.
A new Ag/Pd conductor for automotive applications
1999
6 Seiten, 5 Quellen
Conference paper
English
Adhäsion , Altern (Werkstoff) , Kraftfahrzeugelektronik , Umweltprüfung , Feuchte , Hybridschaltung , integrierte Schaltung , Zuverlässigkeit , Prüfung integrierter Schaltungen , Palladium , Pulvermetallurgie , Silber , Wärmespannung , Dickschichtschaltung , Pulverherstellung , Werkstofftechnik , Automobilindustrie , Kraftwagen , Pulvertechnologie , Versuchsdaten
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