Modern fighter aircraft cannot fly without their on-board computer. In order to predict equipment lifetime, the US Airforce is analyzing fatigue produced by both vibration and temperature. The characteristics of solder are summarized. The determination of vibration life is then examined, with the finite-element analysis involved. Calculations relating to ability to survive thermal cycling are also presented. Compatibility of thermal coefficients of expansion, and the relief of strain by the use of flexible wires, are considered.
Tougher tests for military electronics
Strenge Pruefverfahren fuer militaerische Elektronik
Machine Design ; 61 , 10 ; 105-109
1989
5 Seiten
Article (Journal)
English
METHODE DER FINITEN ELEMENTE , MILITAERISCHES GERAET , TEMPERATUR , INSTRUMENTIERUNG , PRUEFVERFAHREN , WAERMEAUSDEHNUNGSKOEFFIZIENT , KOMPATIBILITAET , FLUGZEUGELEKTRONIK , AMERIKA , BORDRECHNER , LEBENSDAUER , MATERIALERMUEDUNG , LOETVERBINDUNG , MECHANISCHE SCHWINGUNG , DYNAMISCHE PRUEFUNG , DAUERSCHWINGPRUEFUNG , LEBENSDAUERPRUEFUNG , ERMUEDUNG , WEICHLOT , TEMPERATURWECHSELBEANSPRUCHUNG
Tougher test for military electronics
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