The design of power modules for hybrid cars, trucks and off road vehicles requires unique ways of power electronics integration and packaging. The conflicting requirements of highest power density, high ambient temperatures, reliability and lowest cost can only be fulfilled by a careful selection of IGBT and Diode chips, innovative packaging technologies and a consequent optimization of all thermal and electrical device parameters. The new family of SKiM R (Semikron Integrated Module) power modules is the next generation of ultra compact pressure contact modules without base plate. Instead of soldering the DBC (direct bonded copper) substrate to a base plate it is pressed directly to the heat sink. Multiple pressure contacts next to each chip are used, keeping the DBC flat and no bimetal effect known from modules with base plates is disturbing the thermal performance. The elimination of a base plate assures high temperature cycling capability (no solder fatigue caused by CTE mismatch) and a low thermal resistance. This assures a high active and passive temperature cycling capability. The device design was optimised with respect to low thermal resistance and symmetric current sharing between parallel chips. This allows together with the maximum junction temperature of 175 Cel a compact inverter design with a high power density.
Electrical and thermal optimization of an automotive power module family
Elektrische und thermische Optimierung einer Entwicklungslinie von Leistungselektronikmodulen für den Fahrzeugbereich
2007
7 Seiten, 16 Bilder, 2 Tabellen, 2 Quellen
Conference paper
Storage medium
English
Hochleistungs-IGBT-Module für Automotive. Power-Module
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