The design of power modules for hybrid cars, trucks and off road vehicles requires unique ways of power electronics integration and packaging. The conflicting requirements of highest power density, high ambient temperatures, reliability and lowest cost can only be fulfilled by a careful selection of IGBT and Diode chips, innovative packaging technologies and a consequent optimization of all thermal and electrical device parameters. The new family of SKiM R (Semikron Integrated Module) power modules is the next generation of ultra compact pressure contact modules without base plate. Instead of soldering the DBC (direct bonded copper) substrate to a base plate it is pressed directly to the heat sink. Multiple pressure contacts next to each chip are used, keeping the DBC flat and no bimetal effect known from modules with base plates is disturbing the thermal performance. The elimination of a base plate assures high temperature cycling capability (no solder fatigue caused by CTE mismatch) and a low thermal resistance. This assures a high active and passive temperature cycling capability. The device design was optimised with respect to low thermal resistance and symmetric current sharing between parallel chips. This allows together with the maximum junction temperature of 175 Cel a compact inverter design with a high power density.


    Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Electrical and thermal optimization of an automotive power module family


    Additional title:

    Elektrische und thermische Optimierung einer Entwicklungslinie von Leistungselektronikmodulen für den Fahrzeugbereich


    Contributors:
    Wintrich, A. (author) / Beckedahl, P. (author) / Wurm, T. (author)


    Publication date :

    2007


    Size :

    7 Seiten, 16 Bilder, 2 Tabellen, 2 Quellen


    Type of media :

    Conference paper


    Type of material :

    Storage medium


    Language :

    English




    AUTOMOTIVE THERMAL MANAGEMENT FLUID MODULE

    KANG IN KEUN | European Patent Office | 2024

    Free access

    Hochleistungs-IGBT-Module für Automotive. Power-Module

    Grasshoff, Thomas | Tema Archive | 2009


    FLUID MODULE FOR AUTOMOTIVE THERMAL MANAGEMENT

    KANG IN KEUN / KIM YOUNG MAN / LEE KYEONG CHEOL et al. | European Patent Office | 2024

    Free access


    Automotive cooling system thermal management optimization

    Chamone, Cássio Silva Fischer / Thomaz, Fabrício / Maia, Gustavo Fonseca de Freitas | SAE Technical Papers | 2018