The MID (molded interconnect devices) technology provides selective metallization in three dimensions on injection molded thermoplastic substrates and housings. Different technologies can be used to metallize plastic parts. Automotive applications for MID technology are pressure and flow sensors for engine management, air conditioning and crash detection. MR (magnetoresistive) sensors precisely positioned in MID packages are used for motion and position detection. MID provides 3D-positioning of laser diodes and LED's (light emitting diodes) for applications varying from lighting to adaptive cruise control. Tip switches e.g. for steering wheel can be realized on 3D-MID structures. They require reduced space and allow therefore the integration of more electronic functions.


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    Title :

    3D-MID - multifunctional packages for sensors in automotive applications


    Contributors:
    Moser, D. (author) / Krause, J. (author)


    Publication date :

    2006


    Size :

    7 Seiten, 7 Bilder, 1 Quelle




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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