Microsystems technologies (MST) are in widespread use. An ever increasing number of automotive functions rely on MEMS/MOEMS applications. Besides the simple quantitative market numbers the correlations in the value chain, the strategic alliances and willingness for cooperation and sharing of information as well as RTD infrastructure are strong indicators for success in a specific application field and geographical regions. This paper gives an overview about the key microsystems applications and their further market deployment. In addition to the market data, background information such as key players, competitive analysis, market specific situations and interdependencies are reviewed. A brief outlook will discuss the change of the greater picture by the introduction of solutions using data and sensor fusion approaches. It can be assumed that until the reliability of the new systems has reached a level comparable to the one acquired in airplane control systems, cars that were built about 10 years ago will probably represent a peak in reliability: their mechanical systems have matured to very high reliability, but they are not yet quite as loaded with electronic components that their electrical / electronic reliability suffers. Strangely enough, even though some of the regulations are stricter in the US, the European automotive OEMs still seem to be implementing a much larger number of new high tech systems than their US counterparts. Likely reasons for this development can be the extreme price competition and pressure on US brand cars as well as the reduced necessity for high tech control devices due to lower traffic density, lower vehicle speeds, etc. Just like car electrical systems, automotive MEMS is considered as an essential component of individual transport systems and will continue to be the economic and innovation motor for the coming decades.


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    Title :

    The international market for automotive microsystems, regional characteristics and challenges


    Additional title:

    Der internationale Markt der Mikroelektronik im Automobilbau: regionale Merkmale und Herausforderungen


    Contributors:


    Publication date :

    2005


    Size :

    20 Seiten, 5 Bilder, 3 Tabellen, 7 Quellen




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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