Within the European project LIPS (www.ife.ethz.ch/lips) the authors are developing a substrate technology for an all-planar single-substrate 77 GHz radar module for automotive applications. They use an enhanced MCM-D thin-film technology enabling millimeter-wave operation. Compared to the presently known designs the high resolution of the thin-film process eliminates need for post-production tuning. A build up with thick (45 micron) BCB dielectric, combination of microstrip and co-planar waveguides, and integrated resistors in the top-layer are some of the new features in their technology. One output of the project will be a demonstrator of automotive radar front-end. Presently they have designed and manufactured the basic set of interconnects (transmission lines, junctions etc.), millimeter-wave passives and integrated patch antennas required for realization of the radar front-end. In particular, the top-layer resistors have made it possible to create high-quality load terminations, both for measurement purposes and as part of certain passive circuits (like Wilkinson power dividers). They are presenting the measurement results and compare them to the 3D electromagnetic full wave simulations. Measurements have been performed at frequencies up to 110 GHz using on-wafer probing. Advantages and disadvantages of the MCM-D technology for the radar application are discussed.


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    Title :

    Interconnects and integrated passives for a single-substrate 77 GHz automotive radar


    Contributors:


    Publication date :

    2003


    Size :

    6 Seiten, 8 Bilder, 1 Tabelle, 5 Quellen


    Type of media :

    Conference paper


    Type of material :

    Storage medium


    Language :

    English




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