Because of its typical volume structure the automotive test environment has different needs and parameters than a high volume memory or digital production process. The resulting concepts will not be implemented tomorrow, but are an important step to address the future automotive test floor requirements. The last aspect is to increase test coverage in order to drive failure rates towards zero ppm. To achieve this high goal there are different approaches. Test methods like hot/cold temperature, stress tests and burn-in are standard. New Design for Test (DFT) concepts like Iddq, Iddt and BIST to support this test strategy are necessary to meet the high quality demands in the automotive industry. As a matter of fact electronics in cars become more and more important, with the trend towards more functionality and complete systems on chips (SoC). Shared electronics as there are sensors, control units or mechatronics communicate more and more over networks with standardized data interfaces, for example SPI, CAN or LIN bus. The introduction of the 42 V power distribution network with new developments within the fields of mechatronics and X-by-Wire based systems will enforce this trend. Information and communication electronics, respectively telematic applications, will be affected by the 42 V board net just partly. To test 42 V system semiconductors the voltage and current requirements have to be covered. The proceeding integration of logic, memory, AD/DA converters, power management and RF functions within a single chip (SoC) demands flexible architectures of mixed- signal test systems. The possibility of flexible configurations concerning V/I sources, pin electronics, and DSP modules is necessary to address the economic requirements, as well as additional sophisticated DFT methods.


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    Title :

    Future challenges in testing automotive semiconductor devices


    Additional title:

    Künftige Herausforderungen bei der Prüfung fahrzeugtechnischer Halbleiterbauelemente


    Contributors:
    Forstner, F. (author) / Goldbach, M. (author)


    Publication date :

    2003


    Size :

    10 Seiten, 6 Bilder, 4 Quellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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