New generation microcontrollers for automotive applications require a huge number of I/Os, dealing with various sensor and actuator signals derived from the external world. In case of the first TriCore based 32-bit microcontroller this leads to approximately 270 I/Os for signal processing. Adding the power supply lines and thermal balls, the overall number of required interconnections grows far over 300. To outperform standard microcontroller packages, e.g. QFPs, the limitations in terms of package size and maximum number of interconnects have to be improved. Main goal is to adapt the component quality for the high level reliability standard, which is the basis of an implementation into automotive parts. Current tests with a P-BGA standard package show interesting results for the board level reliability, when design and test parameters are changed only slightly.


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    Title :

    High pincount packages under automotive conditions


    Additional title:

    Bauteile mit einer hohen Anzahl von Kontakten für fahrzeugtechnische Anwendungen


    Contributors:


    Publication date :

    2000


    Size :

    4 Seiten, 2 Bilder, 4 Tabellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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