The continual growing demand for Millimeterwave Modules in Digital Radio applications like LMDS (Local Multipoint Distribution System) or LMCS (Local Multipoint Communication System) or MVDS (Microwave Video Distribution System) and related technologies are main part of the business mission in the authors Competence Center 'Micro- and Millimeterwave Technologies' of DaimlerChrysler Aerospace (Dasa). Based on a long term experience and history of modern active phased array radars and different applications (ground based, naval and airborne) the communication module market is still a big challenge for high volume processing in their Microwave Factory. Advanced substrate technologies, based on FR4 multilayers combined with teflon materials and the use of single packaged RF-MMICs with BGA (Ball Grid Array) will be compared with traditional module architectures based on the use of thin film ceramics and Chip&Wire technologies. Results and experience of a 38 GHz radio module with a MCM-C (multichip Module, based on ceramics) in LTCC (Low Temperature Cofired Ceramic) technology will be discussed. Their technology strategy and packaging roadmap is mainly driven by long-term reliability, availability of basic materials and components and modularity. The trends of new module architectures and packaging technologies with GaAs chips in 'Hot-Via' technology will be shown.


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    Title :

    Microwave and millimeterwave technology for digital radios and communications - technology strategy and packaging roadmaps


    Additional title:

    Technologische Strategien für Mikrowellen- und Millimeterwellenschaltungen für das digitale Radio


    Contributors:


    Publication date :

    2000


    Size :

    10 Seiten, 3 Bilder, 2 Tabellen, 5 Quellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English