Historically, alumina substrates have been used for manufacturing and assembly of thick film hybrids. Alumina substrates used for thick film hybrid circuits are not strong mechanically, especially as substrate size increases, and are prone to shattering upon rapid heating and cooling processes. This issue directly influences yield losses due to breaking during all phases of processing and assembly for the hybrid on alumina. Recent technological development and availability of insulating dielectric compositions that can be processed with stainless steel have drastically increased the mechanical strength and integrity of the hybrid circuit. This paper reviews two insulative systems and processes, sequential (old technology) and cofired (new technology) on 430 stainless steel successfully used today. In addition, we discuss in detail the benefits, performance characteristics, advantages and disadvantages of sequentially fired and cofired processing of thick film pastes on stainless steel. The use of this technology will move hybrid circuit manufacturing forward to new application and performance levels within, but not limited to, the automotive industry.
A cofireable dielectric on stainless steel thick film material system for automotive applications
1999
6 Seiten, 5 Quellen
Conference paper
English
Cofireable Dielectric on Steel Thick Film Materials System for Automotive Applications
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