The thermal protection system (TPS) material that has flown on the last five shuttle flights has the unique properties of electrical and dimensional stability over rapid and extreme temperature changes. The TPS also has the desirable properties of a low dielectric constant (epsilon), a low loss tangent (delta), and a low density (e.g., epsilon = 1.1, tan delta = 0.0007, and a weight of 8 1bs per cubic foot for the TPS FRCI-8 material). Unlike conventional high temperature ceramics that are heavy and do not respond well to thermal shock, the TPS has survived immersion in liquid nitrogen at -295 F and the reentry temperature of +2300 F. The excellent thermal performance of the TPS can be attributed to an extremely low coefficient of thermal expansion (2.7 x 10(exp-7) in/in/F and a low density.


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    Title :

    The space shuttle title: A new electronic substrate and radome material


    Additional title:

    Die Space-Shuttle-Kachel als neues elektronisches Substrat und Radom-Material


    Contributors:


    Publication date :

    1983


    Size :

    3 Seiten, 2 Bilder


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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