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    Title :

    Parallel processing of embossing dies with ultrafast lasers


    Contributors:

    Conference:

    Laser-based Micro- and Nanoprocessing XII ; 2018 ; San Francisco,California,United States


    Published in:

    Proc. SPIE ; 10520


    Publication date :

    2018-02-19





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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