The progress of silicon integration has led to the ability to integrate complex systems on a single die. Integration of applications and different application software components on a distributed system-on-chip can be demanding unless one follows a structural system integration approach with architectural support from hardware. The ACROSS Multi-Processor System-on-Chip platform provides architectural means for integration, such as well-defined communication interfaces, deterministic communication schedules, fault-containment and error-confinement support. We present the non-functional requirements of a degraded vision landing system for a helicopter and show how the ACROSS Multi-Processor System-on-Chip research platform alleviates integration of software and system components.


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    Title :

    System Integration of a Degraded Vision Landing Aid Application on a Custom High-Criticality Research Platform


    Additional title:

    Sae Int. J. Aerosp


    Contributors:

    Conference:

    SAE 2012 Aerospace Electronics and Avionics Systems Conference ; 2012


    Published in:

    Publication date :

    2012-10-22


    Size :

    7 pages




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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