Power switching devices in the wide bandgap semiconductor silicon carbide (SiC) are under development in many laboratories in the United States, Europe, and Japan. Because SiC can be thermally oxidized to form SiO2, it is possible to construct MOS-based power devices such as power MOSFETs, IGBTs, and MCTs in this material. This paper outlines the technical challenges which must be overcome before MOS-based power switching devices in SiC can reach the commercial marketplace.


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    Title :

    Development of Fabrication Technology for MOS-Based Power Switching Devices in SiC


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    SAE Aerospace Power Systems Conference ; 1997



    Publication date :

    1997-06-18




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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