This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications. This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.


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    Title :

    Environmental Tests and Associated Failure Mechanisms


    Publication date :

    2014-09-12



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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