This paper will outline the results of a study performed to analyze the market introduction of x-by-wire applications in the context of weak global industry environment, technological and legislative challenges, standardization issues and end customer benefits.This paper attempts to provide a bird-view on influence factors and impacts for the x-by-wire market, including e.g. the end customer's acceptance and legal environment driving further development in specific areas. Further, major driving forces on semiconductor/component level will be outlined regarding e.g. pin-count, computation performance and heat dissipation, but also possible scenarios and solutions towards safe and efficient system design and partitioning.


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    Title :

    X-by-Wire: Opportunities, Challenges and Trends


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    SAE 2003 World Congress & Exhibition ; 2003



    Publication date :

    2003-03-03




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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