The density and pin count for Field Programmable Gate Arrays (FPGAs) has been increasing, and has exceeded current methods of solder joint inspection, making early detection of failures more problematic. These failures are a concern for both flight safety and maintenance in commercial aviation. Ridgetop Group, Inc. has developed a method for detecting solder joint failures in real time. The NASA Dryden Flight Research Center is developing a set of boards to test this method in ground environmental and accelerated testing as well as flight test on a Dryden F-15 or F-18 research aircraft. In addition to detecting intermittent and total solder joint failures, environmental data on the boards, such as temperature and vibration, will be collected and time-correlated to aircraft state data. This paper details the technical approach involved in the detection process, and describes the design process and products to date for Dryden s FPGA failure detection boards.
Solder Joint Health Monitoring Testbed System
Military/Aerospace Programmable Logic Device 2009 (MAPLD 2009) ; 2009 ; Greenbelt, MD, United States
2009-08-31
Conference paper
No indication
English
SPIE | 1994
|British Library Conference Proceedings | 2000
|Pico Satellite Solar Cell Testbed (PSSC Testbed)
NTIS | 2007
|Pico Satellite Solar Cell Testbed (PSSC Testbed)
NTIS | 2005
|