A low cost integration technology has been developed to assemble 2.5 and 10 Gb/s photodiodes. It relies on flip-chipped devices with lensed fibres positioned in V-grooves. For 2.5 Gb/s the photodiode, the fibre and the transimpedance amplifier are integrated on a single Si motherboard compatible with mounting in a mini-dil module. The sensitivity is -23.5 dBm at 10/sup -10/ BER with no error floor.


    Access

    Check access

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Edge photodiode hybrided on Si motherboard for 2.5 Gb/s low cost photoreception


    Contributors:
    Blache, F. (author) / Boucherez, E. (author) / Carpentier, D. (author) / Devaux, F. (author) / Duchemin, C. (author) / Ferling, D. (author) / Giraudet, L. (author) / Goeth, A. (author) / Hayano, J.M. (author) / Jorg, W. (author)


    Publication date :

    2001-01-01


    Size :

    173568 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



    Edge Photodiode Hybrided on Si Motherboard for 2.5Gb/s Low Cost Photoreception

    Blache, F. / Boucherez, E. / Carpentier, D. et al. | British Library Conference Proceedings | 2001


    MOTHERBOARD VEHICLE CHASSIS

    GANO JOHN VICTOR | European Patent Office | 2016

    Free access


    Honeywell FLASH Fiber Optic Motherboard Evaluations

    Stange, K. / IEEE / AIAA | British Library Conference Proceedings | 1996