A low cost integration technology has been developed to assemble 2.5 and 10 Gb/s photodiodes. It relies on flip-chipped devices with lensed fibres positioned in V-grooves. For 2.5 Gb/s the photodiode, the fibre and the transimpedance amplifier are integrated on a single Si motherboard compatible with mounting in a mini-dil module. The sensitivity is -23.5 dBm at 10/sup -10/ BER with no error floor.
Edge photodiode hybrided on Si motherboard for 2.5 Gb/s low cost photoreception
2001-01-01
173568 byte
Conference paper
Electronic Resource
English
Edge Photodiode Hybrided on Si Motherboard for 2.5Gb/s Low Cost Photoreception
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