A packaging design providing "3D micro optical switching system (3D-MOSS)" is expected to reduce waveguide crossing points, system size and wiring distance drastically by using variable well optical integrated circuit (VWOIC).


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    Title :

    3D micro optical switching system (3D-MOSS)-Packaging design


    Contributors:
    Yoshimura, T. (author) / Tsukada, G. (author) / Kawakami, S. (author) / Arai, Y. (author) / Kurokawa, H. (author) / Asama, K. (author)


    Publication date :

    2001-01-01


    Size :

    205478 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English