Several promising technologies and techniques for high power (>100W) TR module packaging have been incorporated into the baseline design of the TR modules for the proposed DESDynI SAR Instrument. A few advanced technologies, which have not been incorporated into the baseline design, including the PCM thermal capacitor and the CE alloys, have been integrated into an advanced module, in order to compare the thermal performance of the baseline flight design to the advanced packaging design.


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    Title :

    Robust, reworkable thermal electronic packaging: Applications in high power TR modules for space




    Publication date :

    2013-03-01


    Size :

    3213058 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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