A substrate cutting device includes: a base portion; a stage on the base portion; a partition member spaced from the stage; and an exhausting structure below the cell substrate and configured to exhaust a gaseous substance. The stage has a top surface configured to support a cell substrate and a connection surface perpendicular to the top surface, and the partition member faces the connection surface and is configured to support the cell substrate.


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    Title :

    Substrate cutting device


    Contributors:
    KIM WOONG (author) / KANG KYUNGWON (author) / KIM BUEMJOON (author) / KIM JIHOON (author) / KIM TEADONG (author) / NOH SUNGHO (author) / SIM JUNHO (author) / SHIM HYUNGBO (author) / LEE HEESUK (author) / HAN JAEKU (author)

    Publication date :

    2021-01-19


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    B62D MOTOR VEHICLES , Motorfahrzeuge / B26D Schneiden , CUTTING



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